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Precision 0.015mm Line Width Micro Etched Lead Frame For Automobile

Shenzhen Xinhaisen Technology Limited
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    Buy cheap Precision 0.015mm Line Width Micro Etched Lead Frame For Automobile from wholesalers
     
    Buy cheap Precision 0.015mm Line Width Micro Etched Lead Frame For Automobile from wholesalers
    • Buy cheap Precision 0.015mm Line Width Micro Etched Lead Frame For Automobile from wholesalers
    • Buy cheap Precision 0.015mm Line Width Micro Etched Lead Frame For Automobile from wholesalers
    • Buy cheap Precision 0.015mm Line Width Micro Etched Lead Frame For Automobile from wholesalers

    Precision 0.015mm Line Width Micro Etched Lead Frame For Automobile

    Ask Lasest Price
    Brand Name : XHS/Customize
    Model Number : Customize
    Certification : ISO 9001, ISO 14001, IATF 16949
    Price : 50-100USD
    Payment Terms : T/T
    Supply Ability : 10000-100000PCD / week
    Delivery Time : 5-10 work days
    • Product Details
    • Company Profile

    Precision 0.015mm Line Width Micro Etched Lead Frame For Automobile

    Precision 0.015mm Line Width Micro Etched Lead Frame for Automobile

    Product Overview

    Xinhsen Technology specializes in manufacturing precision-etched lead frames for semiconductor and microelectronics packaging. Our lead frames serve as the critical interconnection platform for IC chips, providing superior electrical conductivity, heat dissipation, and mechanical stability. Utilizing advanced chemical etching technology, we deliver products with unmatched dimensional accuracy for applications in QFN, DFN, SOP, SSOP and other advanced packaging formats.

    Key Features

    Ultra-Precise Etching Technology

    Achieves fine pitch down to 0.05mm with tight tolerance of ±0.01mm

    Produces smooth burr-free edges for perfect die attachment

    Material Expertise

    Works with various alloys including Cu (C194, C7025), Fe-Ni (Alloy 42), and Kovar

    Thickness range: 0.1mm-1.0mm

    Advanced Design Capabilities

    Complex multi-array patterns with precise half-etching technology

    Custom geometries for specific thermal/electrical requirements

    Superior Quality

    Flatness control within 0.02mm/mm²

    100% automated optical inspection


    Technical Parameters

    Material Options: Copper alloys (C194, C7025), Alloy 42, Kovar

    Thickness Range: 0.1mm-1.0mm

    Minimum Pitch: 0.05mm

    Tolerance: ±0.01mm (critical dimensions)

    Surface Roughness: Ra ≤ 0.8μm

    Package Types: QFN, DFN, SOP, SSOP, DIP, etc.

    Competitive Advantages

    Precision Beyond Stamping

    Achieves finer features and tighter tolerances than conventional stamping

    No mechanical stress or deformation

    Performance Data

    Characteristic

    Xinhsen Standard

    Test Method

    Plating Adhesion

    ≥5B (ASTM B571)

    Tape Test

    Solderability

    ≥95% coverage

    J-STD-003

    Thermal Cycling

    1000 cycles (-55°C~125°C)

    JESD22-A104

    Wire Bond Strength

    ≥8gf (1mil Au wire)

    MIL-STD-883 Method 2011


    Rapid Prototyping

    Sample lead time: 5-7 working days

    DFM analysis included

    Cost-Effective Solutions

    Lower tooling costs compared to stamping

    Flexible MOQ from prototypes to mass production

    Comprehensive Services

    One-stop solution from design to plating (Ag, NiPdAu, etc.)

    ISO 9001 & IATF 16949 certified

    FAQ

    Q: What's the benefit of etched lead frames vs stamped ones?

    A: Etching provides better precision (especially for fine pitch), no burrs, and no mechanical stress on materials.

    Q: Can you handle lead frame arrays for multi-chip packaging?

    A: Yes, we specialize in high-density multi-array designs with precise half-etching technology.

    Q: What surface finishes do you offer?

    A: We provide various plating options including silver, NiPdAu, and selective plating.

    Q: What's your typical production capacity?

    A: We support mass production up to 50 million units/month with consistent quality control.

    Why Choose Xinhsen?

    With 15+ years of precision etching experience, we combine cutting-edge technology with stringent quality control to deliver lead frames that meet the most demanding semiconductor requirements. Our technical team works closely with clients to optimize designs for performance and manufacturability.

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